What We Do
In addition to leveraging existing capabilities at the North Texas Semiconductor Institute, BEACONS, and TxACE, the center will build new laboratory infrastructure and personnel.
MOCVD Laboratory
- Expand materials growth capabilities for Wide Bandgap (WBG) and Ultra Wide Bandgap (UWBG) devices
- Install a MOCVD reactor along with high voltage device test and characterization capabilities
Advanced Packaging Laboratory
- Bring up capabilities for advanced packaging including 3D packaging and integration of passives including magnetics and capacitors
- Laboratory capabilities to study thermal management including
,active and passive cooling technologies, device reliability under harsh conditions - Add research personnel with expertise in advanced packaging, passives, thermal management and reliability
Power Electronics Circuits and Packaging Laboratory
- Laboratory capabilities to build and evaluate power electronics circuits and topologies including capabilities for high voltage packaging and voltage test and validations
- Add research personnel with expertise in power electronic circuits and packaging