Mission Statement
The center will bring together campus-wide resources and establish new capabilities to address energy and thermal management challenges in high power density electronics at the device and package levels.
High Power Density Center of Excellence
Who We Are
The center will work with the Texas Instruments (TI )Kilby Center to address engineering challenges in power and thermal management at the device and package levels.
Primary focus Areas for collaboration are:
Primary focus Areas for collaboration are:
Materials
- Evaluate new materials to manage heat transfer at the device and die level
- Engineer the thermal interface through Multiphysics models and materials and device research
Devices and Passives
- WBG and UWBG devices, BEOL and Vertical power transistors, Embedded passives, and on-chip power transfer devices
Packaging
- Advanced materials and devices to improve thermal management in modules and packages
Circuits and Topologies
- Devices and circuit topologies for data centers, fast charging and battery energy storage